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Value of semiconductor industry M&A deals slows dramatically in 2017
01/18/2018  Numerous smaller deals were made but "megadeals" were scarce last year.

Korea is at full throttle on memory investments

01/17/2018  2017 proved to be record-setting year for the semiconductor industry. According to World Semiconductor Trade Statistics (WSTS), worldwide semiconductor market will have grown 20 percent, exceeding $400 billion for the first time.

ASML announces appointment of new CFO to the Board of Management

01/17/2018  ASML Holding N.V. (ASML) today announces that the Supervisory Board intends to appoint Roger Dassen as Executive Vice President and Chief Financial Officer (CFO) to the Board of Management.

Odyssey Technical Solutions named exclusive distributor for Comet Capacitors in the Americas

01/08/2018  Odyssey Technical Solutions today announced that they have reached agreement with COMET PCT (Plasma Control Technologies) division, located in San Jose, CA. with headquarters in Switzerland, to stock and exclusively distribute the COMET vacuum capacitor line of components for North, Central and South America.

Nordson Corporation acquires Sonoscan

01/04/2018  Nordson Corporation has acquired Sonoscan, Inc., an Elk Grove Village, Illinois-based designer and manufacturer of acoustic microscopes and sophisticated acoustic micro imaging systems used in a variety of microelectronic, automotive, aerospace and industrial electronics assembly applications.

Fabless IC company sales top $100B for first time ever

01/04/2018  Two Chinese companies -- HiSilicon and Unigroup -- are among the top 10 fabless IC sales leaders.

SEMI European 3D Summit makes Dresden debut

12/22/2017  The SEMI European 3D Summit will make its Dresden, Germany, debut 22-24 January, 2018, featuring a broader scope of 3D topics driving innovation and business opportunities in the 3D market.

Revision to SEMI E142: Specification for substrate mapping

12/21/2017  The Korea Advanced Back-end Factory Integration Task Force, in response to the industry's demand, has decided to revise SEMI E142-0211 (Reapproved 1016), Specification for Substrate Mapping by adding an assembly and packaging raw materials traceability method.

aveni extends copper interconnects to 5nm and below for BEOL integration

12/12/2017  aveni S.A., developer and manufacturer of market-disrupting wet deposition technologies and chemistries for 2D interconnects and 3D through silicon via packaging, today announced it has obtained results that strongly support the continued use of copper in the back end of line (BEOL) for advanced interconnects, at and beyond the 5nm technology node.

$55.9B semiconductor equipment forecast: New record with Korea at top

12/12/2017  Today, SEMI, the global industry association representing the electronics manufacturing supply chain, released its Year-end Forecast at the annual SEMICON Japan exposition.

EVG installs low-temp plasma activation system at the University of Tokyo

12/12/2017  EVG 810LT system enables low-temperature direct wafer bonding of III-V compound semiconductor materials and germanium-on-silicon wafers with field-proven high-quality plasma surface preparation.

Leti develops world's first micro-coolers for CERN particle detectors

12/11/2017  Leti, a research institute of CEA Tech, today announced it has created the world's first microfluidic circuit for cooling a particle detector, perhaps paving the way to a revolutionary, new detector technique at the Large Hadron Collider.

Solutions for controlling resin bleed out

12/05/2017  The hows and whys of resin bleed-out (RBO) are discussed, as well as the impact it makes and how to control it.

MORE MATERIALS-AND-EQUIPMENT ARTICLES
TWITTER
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WEBCASTS
Materials

Date and time TBD

Success in electronics manufacturing increasingly relies on the materials used in production and packaging. More than 50 different elements from the periodic table are now used in semiconductor manufacturing, and the list grows even longer when you consider the requirements of flexible/printed electronics, LEDs, compound semiconductors, power electronics, displays, MEMS and bioelectronics. In this webcast, experts will focus on changing material requirements, the evolving material supply chain, recent advances in process and packaging materials and substrates, and the role new materials such as carbon nanotubes will play in the future.

Sponsored By:

MEMS

Date and time TBD

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. We will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:

Interconnects

Date and time TBD

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:

More Webcasts
TECHNOLOGY PAPERS
Leveraging Baseline Checks for Robust Reliability Verification

As IP and IC designers and verification teams tackle increased complexity and expectations, reliability verification has become a necessary ingredient for success. Automotive, always-on mobile devices, IOT and other platforms require increasingly lower power envelopes and reduced device leakage while maintaining overall device performance. Foundries have also created new process nodes targeted for these applications. Having the ability to establish baseline checks for design and reliability requirements is critical to first pass success. January 08, 2018
Sponsored by Mentor Graphics

Media Invitation - FPInnovations and Resolute Forest Products to announce a $21 million investment in the transformation of Canada's forest sector
THUNDER BAY, ON, Jan. 18, 2018 /CNW Telbec/ - FPInnovations and Resolute Forest Products (NYSE: RFP) (TSX: RFP) invite the media to attend a press...
Richards Packaging Income Fund Announces January 2018 Distribution
TORONTO, Jan. 18, 2018 /CNW/ - Richards Packaging Income Fund (TSX: RPI.UN) (the "Fund") announced today its cash distribution for the month ended...
Korea is at full throttle on memory investments
01/17/2018  2017 proved to be record-setting year for the semiconductor industry. According to World Semiconductor Trade Statistics (WSTS), worldwide semiconductor market will have grown 20 percent, exceeding $400 billion for the first time.

ASML announces appointment of new CFO to the Board of Management

01/17/2018  ASML Holding N.V. (ASML) today announces that the Supervisory Board intends to appoint Roger Dassen as Executive Vice President and Chief Financial Officer (CFO) to the Board of Management.

Odyssey Technical Solutions named exclusive distributor for Comet Capacitors in the Americas

01/08/2018  Odyssey Technical Solutions today announced that they have reached agreement with COMET PCT (Plasma Control Technologies) division, located in San Jose, CA. with headquarters in Switzerland, to stock and exclusively distribute the COMET vacuum capacitor line of components for North, Central and South America.

Nordson Corporation acquires Sonoscan

01/04/2018  Nordson Corporation has acquired Sonoscan, Inc., an Elk Grove Village, Illinois-based designer and manufacturer of acoustic microscopes and sophisticated acoustic micro imaging systems used in a variety of microelectronic, automotive, aerospace and industrial electronics assembly applications.

Fabless IC company sales top $100B for first time ever

01/04/2018  Two Chinese companies -- HiSilicon and Unigroup -- are among the top 10 fabless IC sales leaders.

SEMI European 3D Summit makes Dresden debut

12/22/2017  The SEMI European 3D Summit will make its Dresden, Germany, debut 22-24 January, 2018, featuring a broader scope of 3D topics driving innovation and business opportunities in the 3D market.

Revision to SEMI E142: Specification for substrate mapping

12/21/2017  The Korea Advanced Back-end Factory Integration Task Force, in response to the industry's demand, has decided to revise SEMI E142-0211 (Reapproved 1016), Specification for Substrate Mapping by adding an assembly and packaging raw materials traceability method.

aveni extends copper interconnects to 5nm and below for BEOL integration

12/12/2017  aveni S.A., developer and manufacturer of market-disrupting wet deposition technologies and chemistries for 2D interconnects and 3D through silicon via packaging, today announced it has obtained results that strongly support the continued use of copper in the back end of line (BEOL) for advanced interconnects, at and beyond the 5nm technology node.

$55.9B semiconductor equipment forecast: New record with Korea at top

12/12/2017  Today, SEMI, the global industry association representing the electronics manufacturing supply chain, released its Year-end Forecast at the annual SEMICON Japan exposition.

EVG installs low-temp plasma activation system at the University of Tokyo

12/12/2017  EVG 810LT system enables low-temperature direct wafer bonding of III-V compound semiconductor materials and germanium-on-silicon wafers with field-proven high-quality plasma surface preparation.

Leti develops world's first micro-coolers for CERN particle detectors

12/11/2017  Leti, a research institute of CEA Tech, today announced it has created the world's first microfluidic circuit for cooling a particle detector, perhaps paving the way to a revolutionary, new detector technique at the Large Hadron Collider.

Solutions for controlling resin bleed out

12/05/2017  The hows and whys of resin bleed-out (RBO) are discussed, as well as the impact it makes and how to control it.

Reveal previously invisible defects and contaminants in advanced packaging applications

12/05/2017  A new illumination technology compares favorably to conventional bright field illumination.

MORE MATERIALS-AND-EQUIPMENT ARTICLES
TWITTER
!function(d,s,id){var js,fjs=d.getElementsByTagName(s)[0],p=/^http:/.test(d.location)?'http':'https';if(!d.getElementById(id)){js=d.createElement(s);js.id=id;js.src=p+"://platform.twitter.com/widgets.js";fjs.parentNode.insertBefore(js,fjs);}}(document,"script","twitter-wjs");
WEBCASTS
Materials

Date and time TBD

Success in electronics manufacturing increasingly relies on the materials used in production and packaging. More than 50 different elements from the periodic table are now used in semiconductor manufacturing, and the list grows even longer when you consider the requirements of flexible/printed electronics, LEDs, compound semiconductors, power electronics, displays, MEMS and bioelectronics. In this webcast, experts will focus on changing material requirements, the evolving material supply chain, recent advances in process and packaging materials and substrates, and the role new materials such as carbon nanotubes will play in the future.

Sponsored By:

MEMS

Date and time TBD

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. We will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:

Interconnects

Date and time TBD

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:

More Webcasts
TECHNOLOGY PAPERS
Leveraging Baseline Checks for Robust Reliability Verification

As IP and IC designers and verification teams tackle increased complexity and expectations, reliability verification has become a necessary ingredient for success. Automotive, always-on mobile devices, IOT and other platforms require increasingly lower power envelopes and reduced device leakage while maintaining overall device performance. Foundries have also created new process nodes targeted for these applications. Having the ability to establish baseline checks for design and reliability requirements is critical to first pass success. January 08, 2018
Sponsored by Mentor Graphics

Government of Canada Takes Action to Support Innovation in British Columbia's Forest Sector, Sustain Middle-class Jobs for Canadians
PRINCE GEORGE, BC, Jan. 17, 2018 /CNW/ - Innovation in the forest sector will help to combat the effects of climate change, create new markets for...
Argentina energy producer Genneia weighs IPO
BUENOS AIRES, Jan 17- Argentine thermal and renewable energy producer Genneia SA will consider an initial public offering on the local or international stock market, the company said in a letter to the Buenos Aires stock exchange on Wednesday. The proposal will be discussed at a shareholders meeting on Feb. 7, said the letter from the company, which currently is...
/R E P E A T -- Media Advisory - Minister Carr visits Prince George, B.C., to take part in BC Natural Resources Forum, announce support for forest industry/
PRINCE GEORGE, BC, Jan. 15, 2018 /CNW/ - Canada's Minister of Natural Resources, the Honourable Jim Carr, will take part in the 15th Annual BC...
West Fraser Timber Co. Ltd. ("WFT") - Notice of Fourth Quarter Results Conference Call
VANCOUVER, Jan. 15, 2018 /CNW/ - West Fraser will hold an analysts' conference call to discuss fourth quarter 2017 financial and operating results...
Media Advisory - Minister Carr visits Prince George, B.C., to take part in BC Natural Resources Forum, announce support for forest industry
PRINCE GEORGE, BC, Jan. 15, 2018 /CNW/ - Canada's Minister of Natural Resources, the Honourable Jim Carr, will take part in the 15th Annual BC...
Resolute to Host Management Call to Discuss Fourth Quarter and 2017 Annual Results
MONTRÉAL, Jan. 12, 2018 /CNW Telbec/ - Resolute Forest Products Inc. (NYSE: RFP) (TSX: RFP) expects to announce its annual financial results on...
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